| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting type film adhesive composition and a thermosetting type film adhesive tape which have sufficient adhesive force to both of an IC module raw material and an IC card base material related to adhesion of the IC module raw material to the IC card base material, and can be produced efficiently and rapidly while an adhesive layer is so flexible as to absorb bending stress and shock applied to the IC card, and further in which deformation of an adhesive layer under a high temperature is prevented. SOLUTION: Related to the thermosetting type film adhesive composition, a resin composition comprising (A) 32-75 wt.% of nitril-butadiene rubber, (B) 24-65 wt.% of phenol resin and (C) 0.2-9 wt.% of hexamethylene tetramine is solved in (D) an organic solvent, and then the organic solvent is removed until the concentration in which substantially it does not remain, thereby the composition becomes a film having a thickness of 10-150μm. COPYRIGHT: (C)2006,JPO&NCIPI
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