发明名称 DUAL LAYER BUS ARCHITECTURE FOR SYSTEM-ON-A-CHIP
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an effective bus architecture for reducing the amount of main system bus bandwidth to be consumed by various multimedia processing procedures. <P>SOLUTION: The bus architecture comprises a main bus designed and adapted to connect a microprocessor, an image capture module, and a dual master module to a high density memory and a secondary bus operating independently of the main bus and designed and adapted to connect the dual master module to a high-speed secondary memory. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006191545(A) 申请公布日期 2006.07.20
申请号 JP20050351039 申请日期 2005.12.05
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 PARK HYUN-SANG
分类号 G06F15/78;G06F12/00;G06F13/16;G06F13/36;H04N5/92;H04N19/42;H04N19/423;H04N19/50;H04N19/513 主分类号 G06F15/78
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