Method of eliminating galvanic corrosion in copper CMP

摘要

A method for cleaning a semiconductor wafer surface comprises sweeping the semiconductor wafer surface and applying a first cleaning solution having a first pH, stop applying the first cleaning solution and applying a first rinsing solution to the semiconductor wafer surface, the first rinsing solution having a second pH that is significantly different from the first pH, sweeping the semiconductor wafer surface and applying a second cleaning solution having a third pH, and stop applying the second cleaning solution and applying a second rinsing solution to the semiconductor wafer surface, the second rinsing solution having a fourth pH that is significantly different from the third pH.