| 摘要 |
<p>PURPOSE: A wire bonding method is provided to freely control a tilt angle of a tilted surface formed on a bump by avoiding a contact between a wire and a circuit board or between the wire and an interconnection after the wire and the bump are attached and by removing the necessity of replacing a capillary. CONSTITUTION: After the first bonding process is performed on the first conductor, the second bonding process is performed on the second conductor. The first and second conductors are wire-bonded to each other. A ball bonding process is performed on the second conductor to form a bump(10). After a capillary(5) ascends, the capillary is transferred downward in an opposite direction to the first conductor to form a tilted surface on the bump. After the first bonding process is performed, a wire(4) is looped from the first conductor to the bump and the second bonding process is performed on the tilted surface on the bump.</p> |
