发明名称 |
Package having dummy package substrate and method of fabricating the same |
摘要 |
A package may include a stack of unit chip packages, and each unit chip package may include a printed circuit board. The printed circuit board may support a semiconductor chip and a connection terminal for connecting to an adjacent unit chip package within the stack. A dummy package substrate may be disposed on the semiconductor chip of the uppermost unit chip package for protecting the semiconductor chip of the uppermost unit chip package. A method of fabricating a package may involve stacking unit chip packages so that the printed circuit board of a lower unit chip package abuts against a solder bump of an upper unit chip package, and stacking a dummy package substrate on the printed circuit board of an uppermost unit chip package.
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申请公布号 |
US2006049501(A1) |
申请公布日期 |
2006.03.09 |
申请号 |
US20050100526 |
申请日期 |
2005.04.07 |
申请人 |
LEE YOUNG-MIN;YEOM KUN-DAE |
发明人 |
LEE YOUNG-MIN;YEOM KUN-DAE |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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