TAPE FOR PROCESSING WAFER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a tape for processing a wafer which suppresses chipping when the wafer is laminated and diced. SOLUTION: The tape for processing the wafer includes an intermediate resin layer and an adhesive layer sequentially laminated on a substrate film. The peak (glass transition point) of tanδobtained by the dynamic viscoelasticity measurement of the intermediate resin layer coated and formed on the substrate film is -20°C or higher which is higher than the glass transition point of the adhesive layer. COPYRIGHT: (C)2006,JPO&NCIPI