| 摘要 |
The invention relates to a chip remover comprising a working surface (6) which is used to position a chip carrier (7), whereon a defective chip (8) can be separated by at least one tool (16). Different, exchangeable tools (16) co-operating with a device (15), in order to produce a shearing force necessary for separating the chip (8), are used according to the shape and size of the chip (8). A lower source of heat (9) is provided for the chip carrier (7), in addition to an upper source of heat (40) for the chip (8). The upper source of heat (40) is actively connected to a heating element (45) corresponding to the chip size and can be placed upon the surface of the chip in a heating axis (A) which is central in relation to the chip (8), or can be applied immediately next to the surface of the chip. The device (15) can be horizontally adjusted and the respective tool (16) can be controlled, from a chip edge (8c) and back, according to chip size, in relation to the heating axis (A). An optimal amount of shearing force is produced for each chip size and targeted heating is ensured. |
