PRINT WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a print wiring board which achieves an excellent solderability in a simplified manufacturing process and its manufacturing method. SOLUTION: An alloy layer is formed at the interface between a through-hole conductor 12 and a conductor foil 13a by filling the through-hole conductor 12 into a through-hole 11d of an insulating substrate 11a, and adhering the through-hole conductor 12 and the conductor foil 13a arranged on the insulating substrate 11a with heat and pressure. COPYRIGHT: (C)2005,JPO&NCIPI