摘要 |
A laser beam inspection equipment for inspecting the flaw of a sample, e.g. a semiconductor integrated circuit, utilizing a laser beam. The laser beam inspection equipment irradiates a sample, supplied with a constant current or applied with a constant voltage, with a laser beam and indirectly detects a current variation or an electric field variation corresponding to a variation in the resistance of the sample caused by scanning the surface of the sample with the laser beam. For example, the current variation is detected indirectly by detecting a variation in the magnetic field caused by a current flowing through a feeder line between a constant voltage source and the sample by means of a magnetic field detector, and a defective part of the sample can be specified by detecting the variation in the magnetic field.
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