High current feedthru device

摘要

The present disclosure is to a high current multi-layer chip-type feedthru device that may be composed of multiple alternating layers of conductive material and semiconductor material in a fashion to form a feedthru capacitor with transient suppression properties. The disclosed technology provides a feedthru device with significantly improved current handling capability relative to previously known devices having a similar form factor. The improved current handling capability is achieved by a translation of component geometry that results in a substantial decrease in the feedthru capacitor's internal resistance. The conductive layers interleaved among the layers of semiconductive material are characterized as either main signal carrying conductors or transient grounding electrical conductors. Main signal carrying conductors extend along the generally shorter width of the feedthru device, and are characterized by a substantially wide current path. Transient grounding conductors extend in a generally perpendicular fashion to the main signal carrying conductors along the length of the feedthru device. A plurality of solder elements may be plated to the feedthru device for electrically connecting selected of the conductive layers.