发明名称 COATING FILM FORMING APPARATUS AND COATING FILM FORMING METHOD
摘要 <p>The coating film forming apparatus and the coating film forming method of controlling the generation of the transcript mark on the surface of the substrate and preventing the particle from adhering to the back of the substrate is offered. Resist coating processor (CT) 23a have stage 12 in which two or more gas jet entrances 16a to jet the gas were installed, substrate transportation mechanism 13 transported LCD substrate G in the direction of X on the stage 12 and resist supply nozzle 14 that supplies the resist liquid to the surface of LCD substrate G that moves on the stage 12. LCD substrate G is transported on the stage 12 with substrate transportation mechanism 13 while having floated from the surface of stage 12 with the gas jetted from gas jet entrance 16a in the horizontal posture.</p>
申请公布号 KR20050079637(A) 申请公布日期 2005.08.10
申请号 KR20050009075 申请日期 2005.02.01
申请人 TOKYO ELECTRON LIMITED 发明人 YAMASAKI TSUYOSHI;MIYAZAKI KAZUHITO;TATEYAMA KIYOHISA
分类号 G03F7/16;B05B13/02;B05C5/00;B05C5/02;B05C11/10;B05C13/00;B05D1/02;B05D1/42;B05D3/00;C03C17/00;H01L21/02;H01L21/027;(IPC1-7):H01L21/02 主分类号 G03F7/16
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