| 摘要 |
PROBLEM TO BE SOLVED: To remove resin residue and solder residue as much as possible so that an electrode pad of a printed wiring substrate hardly peels, and that cream solder printing is applicable. SOLUTION: The device for removing a CSP100 which is mounted on a printed wiring substrate 110 by bonding between electrode pads 103 by a solder ball 104 and resin sealing is provided with: a tubular part 200 which is applied to enclose the CSP; a plurality of printed wiring substrate press parts 203-206 which correct warp of the printed wiring substrate by selecting a position which is free from a component in the periphery of the CSP covered with the tubular part 200; a laser scanner for scanning a flat portion which is free from a component in the periphery of the printed wiring substrate pressed by a plurality of printed wiring substrate press parts; and an end mill 207 which moves in a horizontal direction and a height direction, cuts the CSP, prevents cutting of the surface of the printed wiring substrate based on reformation of warp of the printed wiring substrate after the CSP is cut and correction of warp of the printed wiring substrate, and cuts resin residue and solder residue. COPYRIGHT: (C)2005,JPO&NCIPI
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