Verwendung einer sprühkompaktierten Kupfer-Nickel-Mangan-Legierung,申请号DE20015006520-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Verwendung einer sprühkompaktierten Kupfer-Nickel-Mangan-Legierung
摘要
申请公布号	DE50106520(D1)	申请公布日期	2005.07.21
申请号	DE20015006520	申请日期	2001.04.19
申请人	WIELAND-WERKE AG	发明人	BOEGEL, DR.;OHLA, DR.;MUELLER, DR.;KEPPELER, FRANK MICHAEL;HENDRIK, DR.
分类号	C22C9/05;C22C9/06;(IPC1-7):C22C9/06	主分类号	C22C9/05
代理机构		代理人
主权项
地址

您可能感兴趣的专利

IGBT AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING SPLIT GATE MEMORY WITH IMPROVED RELIABILITY

FREQUENCY MULTIPLIER BASED ON A LOW DIMENSIONAL SEMICONDUCTOR STRUCTURE

ULTRA-LONG SILICON NANOSTRUCTURES, AND METHODS OF FORMING AND TRANSFERRING THE SAME

Fin Structure of Semiconductor Device

ORGANIC LIGHT EMITTING DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME

ORGANIC LIGHT EMITTING DISPLAY APPARATUS

PHOTOCHARGE STORAGE ELEMENT AND DEVICES INCLUDING THE SAME

RESISTANCE VARIABLE MEMORY CELL STRUCTURES AND METHODS

Method Of Manufacturing Semiconductor Device And Semiconductor Device Having Unequal Pitch Vertical Channel Transistors

Thin Active Layer Fishbone Photodiode With A Shallow N+ Layer and Method of Manufacturing the Same

SEMICONDUCTOR IMAGE SENSORS HAVING CHANNEL STOP REGIONS AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR CIRCUIT STRUCTURE

TUNGSTEN GATES FOR NON-PLANAR TRANSISTORS

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATION METHOD

CHIP ATTACHMENT SYSTEM

Semiconductor Devices and Methods of Fabricating the Same

METHODS OF FORMING LOW RESISTANCE CONTACTS

HANDLER WAFER REMOVAL BY USE OF SACRIFICIAL INERT LAYER