| 摘要 |
<p>Plastic card, made with a cavity for a microcircuit module comprising a supporting film with a printed circuit carrying the microcircuit, has the base of the cavity made so that the resin holding the module in place adheres more strongly to the cavity than to the supporting film. The base of the cavity is treated to increase the resin's adhesion to it. The plastic card (11), made with a cavity (12) for a microcircuit module (22) comprising a supporting film (23) with a printed circuit carrying the microcircuit (26), has the base of the cavity made so that the resin (30) holding the module in place adheres more strongly to the cavity than to the supporting film. The body of the card is made from a plastic with a low surface energy, and the base of the cavity is treated, e.g. by a chemical, mechanical, laser, gas plasma, corona or UV radiation process, to increase the resin's adhesion to it, so that the micro-circuit cannot be removed without separating the microcircuit from the supporting film and destroying it.</p> |
