发明名称 ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a liquid-cooled jacket and system for cooling an electronic apparatus, high in cooling efficiency, demanding less time and cost for manufacture, and fittable into a small space. SOLUTION: Plates for lamination prepared by punching are laminated one after another in the direction of width, and then combined. A liquid coolant travels though passages formed in between the laminated plates, with the laminated plates themselves serving as cooling fins. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005166855(A) 申请公布日期 2005.06.23
申请号 JP20030402369 申请日期 2003.12.02
申请人 HITACHI LTD 发明人 MATSUSHIMA HITOSHI;MATSUSHITA SHINJI;ASANO ICHIRO;TAKEUCHI NOBUFUSA;SUZUKI ATSUSHI
分类号 F25D17/02;F25D9/00;F28F3/12;G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D17/02
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