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发明名称
STACKED CHIP PACKAGE
摘要
申请公布号
KR20050054359(A)
申请公布日期
2005.06.10
申请号
KR20030087720
申请日期
2003.12.04
申请人
HYNIX SEMICONDUCTOR INC.
发明人
KIM, JONG HYUN
分类号
H01L23/12;(IPC1-7):H01L23/12
主分类号
H01L23/12
代理机构
代理人
主权项
地址
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