MANUFACTURING METHOD OF CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To improve soldering property between a pattern of a circuit board and a lead-equipped component in the circuit board having conductive parts on both surfaces of the circuit board. SOLUTION: Pattern connection of a soldered surface and a component surface is made excellent by subjecting a metal mask processing only to a component surface side land 3 of a through-hole 2 formed in the board, applying a cream solder 5, and soldering a chip component 6 by melting the cream solder 5 by reflowing and simultaneously solder-plating the through-hole 2. COPYRIGHT: (C)2005,JPO&NCIPI