| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that when an electrode or wiring is patterned as an insulating resin sheet onto both sides of an insulating resin in a semiconductor device that adopts, as a support substrate, a flexible sheet having a conductive pattern, mounts a semiconductor element onto it, and molds the whole, if the warp of this insulating resin sheet is noticeable, work efficiency is lowered, warping of a package is caused, etc. SOLUTION: The front surface of an insulating resin 2 is so formed that a first conductive film 3 is formed all over its surface or that it is patterned onto it. However, the rear surface of the insulating resin is so formed that a second conductive film 4 formed thicker than the first conductive film 3 is formed. Thus, the fact that the rear surface of the insulating resin sheet 1 has the thickly formed second conductive film 4 can prevent the warp from being caused by a difference in the expansion coefficient. COPYRIGHT: (C)2005,JPO&NCIPI
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