| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method for providing a deposit by using a copper plating bath capable of directly depositing a seed layer on a barrier layer, and besides a smoother and more uniform deposit than that provided by using a common seed-layer-repairing bath. SOLUTION: Compositions suitable for electroplating copper including one or more sources of copper, one or more alkanolamines or polymer amines; and water are provided. The composition has a pH of more than 7, and does not contain a similar reducing agent. These compositions are useful in the deposition and repair of the seed layers used in the manufacture of electronic devices. Methods using these compositions are also provided. COPYRIGHT: (C)2005,JPO&NCIPI |
