| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having stacked via holes through which the electrical connection between conductor layers can be maintained even when heat is loaded and which is not lowered in reliability. SOLUTION: This multilayer wiring board is constituted so that the thickness Tj of the j-th (wherein, j is a natural number of 1≤j≤m) insulating layer 3, the diameter Dj of the connecting surface of a via hole 5 formed in the j-th insulating layer 3 with a conductor layer 2 on a substrate 1 side, and the diameter Ds of the connecting surface of a via hole 5 formed in the first (j=1) insulating layer 3, may respectively become (number 1) and (number 2) when the most base substrate-side insulating layer of insulating layers 3 having stacked via holes 5 is named as the first insulating layer. The via holes 5 are constituted in the filled via holes 5 by filling the via holes 5 with conductors. COPYRIGHT: (C)2005,JPO&NCIPI |
