发明名称 Semiconductor device and manufacturing method therefor
摘要 A semiconductor device which, even when a vertical transistor is adopted, is able to prevent a product yield from decreasing and performance from deteriorating, and at the same time, to achieve high-density integration of chips and high performance. The semiconductor device include: a semiconductor substrate; a tower-like gate pillar formed on the semiconductor substrate via an insulation layer and including a channel region formed so as to be positioned between impurity diffusion regions in a layering direction; a gate insulation film formed on an outer surface of the gate pillar; and a gate electrode film formed on an outer surface of the gate insulation film; in which the gate electrode film is formed of multiple layers each formed in order from the gate pillar, in the direction where the gate electrode film is formed.
申请公布号 US2004232480(A1) 申请公布日期 2004.11.25
申请号 US20040849211 申请日期 2004.05.20
申请人 OHTA HIROYUKI;KUMAGAI YUKIHIRO;MONIWA MASAHIRO;NASU SHINGO 发明人 OHTA HIROYUKI;KUMAGAI YUKIHIRO;MONIWA MASAHIRO;NASU SHINGO
分类号 H01L21/28;H01L21/20;H01L21/265;H01L21/336;H01L21/8234;H01L21/8239;H01L21/8244;H01L27/00;H01L27/04;H01L27/06;H01L27/088;H01L27/105;H01L27/11;H01L29/423;H01L29/49;H01L29/76;H01L29/78;H01L29/786;(IPC1-7):H01L29/76 主分类号 H01L21/28
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