发明名称 |
Semiconductor device and manufacturing method therefor |
摘要 |
A semiconductor device which, even when a vertical transistor is adopted, is able to prevent a product yield from decreasing and performance from deteriorating, and at the same time, to achieve high-density integration of chips and high performance. The semiconductor device include: a semiconductor substrate; a tower-like gate pillar formed on the semiconductor substrate via an insulation layer and including a channel region formed so as to be positioned between impurity diffusion regions in a layering direction; a gate insulation film formed on an outer surface of the gate pillar; and a gate electrode film formed on an outer surface of the gate insulation film; in which the gate electrode film is formed of multiple layers each formed in order from the gate pillar, in the direction where the gate electrode film is formed. |
申请公布号 |
US2004232480(A1) |
申请公布日期 |
2004.11.25 |
申请号 |
US20040849211 |
申请日期 |
2004.05.20 |
申请人 |
OHTA HIROYUKI;KUMAGAI YUKIHIRO;MONIWA MASAHIRO;NASU SHINGO |
发明人 |
OHTA HIROYUKI;KUMAGAI YUKIHIRO;MONIWA MASAHIRO;NASU SHINGO |
分类号 |
H01L21/28;H01L21/20;H01L21/265;H01L21/336;H01L21/8234;H01L21/8239;H01L21/8244;H01L27/00;H01L27/04;H01L27/06;H01L27/088;H01L27/105;H01L27/11;H01L29/423;H01L29/49;H01L29/76;H01L29/78;H01L29/786;(IPC1-7):H01L29/76 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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