| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed substrate or a package substrate, in which even if an IC chip in a high frequency region over 3GHz is mounted, any malfunction or error is not caused. SOLUTION: In a multilayer substrate provided with a power supply layer on a surface layer or an inter layer of a core substrate, distances themselves between an IC chip 90-an inter layer insulating layer-the power supply layer of the core substrate-a power supply terminal 96 are shortened and a total transmission line distance is shortened by making the insulating layer of the core substrate thin. Therefore, a conductor resistance between lines can be reduced, and an electrical transmission such as a flowing signal line is not inhibited. COPYRIGHT: (C)2005,JPO&NCIPI |
