| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for measuring rapidly and accurately the warped quantity of a solid photographing element on whose light receiving surface fine irregularities are formed. SOLUTION: In the method, firstly, measurement points present in the region of an area 10 having no on-chip lens are so measured by using an AF active system or other methods as to determine a virtual reference plane A from the measurement points (b). As shown in (b), the virtual reference plane A may be inclined. Then, the scanning scope of an AF area contrast system is so determined by using the virtual reference plane A as a reference as to measure within the scope measurement points present in an area 9 having on-chip lenses (c). Therefore, the measurement time taken in (c) can be shortened by shortening the scanning scope of the AF area contrast system, and since the AF area contrast system is used, accurate distance-measurements are made possible even in the case of the irregularities caused by the on-chip lenses being existent. COPYRIGHT: (C)2005,JPO&NCIPI
|
