HOT-MELT ADHESIVE OF LOW VISCOSITY

摘要

The invention relates to a low-viscosity hotmelt adhesive containing A) at least one hydrocarbon resin solid at 20° C. with a softening temperature of 70 to 140° C., B) at least one oil with an average molecular weight of >500 and preferably C) a styrene block copolymer. The new hotmelt adhesive is distinguished by a melt viscosity of essentially only 500 to 3200 mPas at 150° C. for a softening temperature of 60 to 115° C. It is preferably used in the field of hygiene for bonding films, nonwovens and/or shaped articles of cellulose derivatives, being distinguished by particular resistance to dermatologically compatible coatings.