SOLDER PASTE AND PRINTED BOARD

摘要

A solder paste prepared by kneading an alloy powder and a flux, wherein the alloy powder is a mixed powder of at least one Sn-Zn based alloy powder and at least one Sn-Ag based alloy powder which optionally contains one or more of Bi, In, Cu and Sb, wherein the mixed powder contains 5 to 10 mass % of Zn, 0.005 to 1.5 mass % of Ag, and optionally contains one or more of 0.002 to 1.0 mass % of Cu, 0.005 to 15 mass % of Bi, 0.005 to 15 mass % of In, 0.005 to 1.0 mass % of Sb, and contains the balanced amount of Sn.