| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly dense, light and thin multi-layer flexible printed wiring board whose inter-layer connection reliability is high. SOLUTION: In a double-sided circuit board whose both faces are provided with conductor circuits, and whose intermediate layer is formed with a resin layer as an insulating layer, the conductor circuits are connected through a conductor bump, coating layers having openings are laminated on the conductor circuits, a copper plated layer is laminated on the opening of at least one coating layer and the coating layer, another conductor circuit is formed in the copper plated layer, and another coating layer having an opening is laminated on the conductor circuit so that a multi-layer flexible printed wring board can be configured. Also, the copper plated layer is laminated on the opening of at least one coating layer and the coating layer, another conductor circuit is formed in the copper plated layer, and another coating layer having an opening is laminated on the conductor circuit. These processes are repeated several number of times so that the multi-layer flexible printed wiring board described in a claim page 1 can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI |
