MATERIAL TRANSFER SETTING APPARATUS OF TRIM FORM SYSTEM FOR SEMICONDUCTOR PACKAGE TO PRECISELY SET POSITION OF LEADFRAME MATERIAL TRANSFERRED AND SUPPLIED DUE TO OPERATION OF BELT

摘要

PURPOSE: A material transfer setting apparatus of a trim form system for a semiconductor package is provided to precisely set the position of a leadframe material transferred and supplied due to an operation of a belt by installing a sensor and a vertically moving stopper at the end of a guide rail included in a guide part of a trim form system. CONSTITUTION: A guide part(G) includes a guide rail(R) and a floater(FL) that moves up/down in a trim form system between a supply part(IN) to which a leadframe material(100) is supplied and a singulation part(SG) in which the leadframe is singulated. In a material transfer setting apparatus, a sensor A(20) and vertically moving stopper A(30) are installed at the end of the guide rail of the guide part, and a sensor B(40) and a vertically moving stopper B(50) are installed at a side of the end of the floater.