PROCESS FOR PROVIDING BOND ENHANCEMENT AND AN ETCH RESIST IN THE FABRICATION OF PRINTED CIRCUIT BOARDS
摘要
<p>A process for providing bond enhancement and an etch resist for a printed circuit board is provided. A sheet comprising at least a layer of copper is immersed in a first immersion tin solution comprising a tin metal and a complexing agent in an acidic medium for a time sufficient to deposit a first heavy tin deposit on the sheet. The sheet is then immersed in a second immersion tin solution comprising stannous tin ions and stannic tin ions and a complexing agent in an acidic medium for a time sufficient to deposit a second thin tin deposit on the sheet. The second thin tin deposit has a thickness less than a thickness of the first heavy tin deposit. A rough surface texture providing mechanical adhesion sites results. The board is then treated with a coupling agent, such as silane, for enhanced bonding to a subsequent epoxy or other polymer prepreg. Additionally, the first heavy tin deposit may serve as an etch resist in subsequent fabrication of the provided circuit board.</p>
申请公布号
WO2004073890(A1)
申请公布日期
2004.09.02
申请号
WO2000US10939
申请日期
2000.04.24
申请人
DEMASO, ARTHUR, J.;GOSSELIN, KATHY, A.;MCKENNEY, DARRYL, J.;WILSON, CRAIG, S.
发明人
DEMASO, ARTHUR, J.;GOSSELIN, KATHY, A.;MCKENNEY, DARRYL, J.;WILSON, CRAIG, S.