| 摘要 |
PURPOSE: Provided are an epoxy resin curing agent and a curable epoxy resin composition each of which gives a cured product that is excellent in heat resistance and has a low dielectric constant, a low dielectric loss tangent and a low water absorptivity. CONSTITUTION: The epoxy resin curing agent has a number average molecular weight of 500 to 3,000 and is represented by the formula (1), wherein: -(O-X-O)- represents a moiety of the formula (2), in which R1, R2, R7 and R8 are the same or different and represent a halogen atom, a C1-C6 alkyl group or a phenyl group, R3, R4, R5 and R6 are the same or different and represent a hydrogen atom, a halogen atom, a C1-C6 alkyl group or a phenyl group, and A is a direct bond or a linear, branched or cyclic C1-C20 hydrocarbon group; -(Y-O)- is a moiety of the formula (3), in which R9 and R10 are the same or different and represent a halogen atom, a C1-C6 alkyl group or a phenyl group and R11 and R12 are the same or different and represent a hydrogen atom, a halogen atom, a C1-C6 alkyl group or a phenyl group, or -(Y-O)- is a random arrangement of at least two kinds of moieties of the formula (3); and each of a and b is an integer of 0 to 30, provided that at least either a or b is not 0.
|
