| 发明名称 |
MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME PASSIVE ELEMENT ARRAY, AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To try to save labor in designing in a multilayer printed circuit board, while making it easy to cope with multiple models. <P>SOLUTION: A multilayer printed circuit board 1 has a wiring layer 2 formed with a wiring and an array layer 3 connected electrically with the wiring layer 2. The array layer 3 contains a general-purpose passive element array in which a plurality of passive elements are arrayed regularly. In order to constitute a desired circuit, an electric connection regarding the passive element selected from among passive element arrays is carried out. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004207518(A) |
申请公布日期 |
2004.07.22 |
| 申请号 |
JP20020375413 |
申请日期 |
2002.12.25 |
| 申请人 |
NOKIA CORP |
发明人 |
HASHIZUME KENICHI;ILKKA ULVAS;FUJII TAKAHARU;ERIKSSON TIMO |
| 分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
