| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board on which the electrode of an electronic component can be connected firmly to a soldering pad. SOLUTION: After an electroless-plated copper layer 3a is formed on the surface of an insulating substrate 1 in a coating state, a first plating resist layer 11 having an opening 11a is formed on the copper layer 3a, and an electroplated copper layer 3b is formed on the portion of the copper layer 3a exposed in the opening 11a. Then, after the resist layer 11 is peeled off, a second plating resist layer 12 having an opening 12a, through which the central part of the electroplated copper layer 3b is exposed, is formed on the copper layer 3b, and an electroplated nickel layer 5 is formed on the central part of the electroplated copper layer 3b exposed in the opening 12a. After the second resist layer 12 is peeled off, in addition, the soldering pad 3 is formed by etching off the electroless-plated copper layer 3a except the soldering pad forming portion of the layer 3a. Thereafter, the outer peripheral section of the pad 3 is blackened, and the pad 3 is coated with an electroless-plated gold layer 6. Finally, a solder-resistant resin layer 4 is formed. COPYRIGHT: (C)2004,JPO
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