发明名称 |
Semiconductor device and a method of manufacturing the same |
摘要 |
In a method of manufacturing a semiconductor device comprising: having a first wiring extending in a first direction; and a second wiring connected to the first wiring through a connection and extending in a second direction orthogonal to the first direction, the second wiring having a surplus portion projecting from the connection in a direction opposite to the second direction, the first and second wirings are arranged such that a center of the connection is offset in the second direction from a center of the first wiring, and a projecting portion of the first wiring is disposed under the connection.
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申请公布号 |
US2004056280(A1) |
申请公布日期 |
2004.03.25 |
申请号 |
US20030647373 |
申请日期 |
2003.08.26 |
申请人 |
MURATA TOMOO;YABUKI SHINOBU;YAMASHITA TAKEO |
发明人 |
MURATA TOMOO;YABUKI SHINOBU;YAMASHITA TAKEO |
分类号 |
H01L21/3205;H01L21/768;H01L21/82;H01L21/822;H01L21/8234;H01L23/52;H01L23/528;H01L27/04;H01L27/088;H01L27/118;(IPC1-7):H01L21/82;H01L27/10 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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