发明名称 |
Three-dimensional intergrated inductor, its module and fabrication method of the same |
摘要 |
A three dimensional adjustable high frequency inductor, its module and fabrication method of the same; the high frequency module comprises micro high frequency inductors, filters, resistors, capacitors and associated with active components or power components to form a hybrid circuit, then it is packaged by using the technology of flip chip or wafer level packaging, so as to upgrade properties of high frequency modules and reduce the packaging and instrumentation costs by minimizing the modular size.
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申请公布号 |
US2004036569(A1) |
申请公布日期 |
2004.02.26 |
申请号 |
US20020223362 |
申请日期 |
2002.08.20 |
申请人 |
ASIA PACIFIC MICROSYSTEMS, INC. |
发明人 |
TSAI SHU-HUI;LIANG SHANG-YU;LEE CHUN-HSIEN |
分类号 |
H01F17/00;H01F41/04;H01L27/08;(IPC1-7):H01F5/00 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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