| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for picking up a chip on a wafer sheet which can reduce a load on the chip when the chip is picked up while the chip is pushed up by a needle of a pepper pot, and which can prevent the chip from being damaged. SOLUTION: The method for picking up the chip on the wafer sheet includes the steps of bringing an upper surface of the pepper pot 4 into contact with a lower surface of the sheet 1, sucking the chip 2 on the pot 4 by vacuum with a nozzle 9 for picking up the chip, and raising the nozzle 9 while the chip 2 is pushed up by projecting the needle 5 from a hole 7 of the pot 4. In this case, the pot 4 is ultrasonic-vibrated by an ultrasonic oscillator 21. Then, bubbles are generated in a bond for adhering the chip 2 on the sheet 1 by cavitation. Thus, since the adhesion of the bond is largely lowered, the chip 2 can be easily picked up by the nozzle 9. COPYRIGHT: (C)2004,JPO
|
