发明名称 METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing laminated electronic component in which green sheets are laminated in higher accuracy. SOLUTION: A head 3 provided with a punch hole 4 is moved downward to a plate 1 where a punch pin 2 is embedded and fixed. In this timing, the punching and boring work of the green sheet and the lamination work to laminate the bored green sheet on the green sheet which has been bored previously are performed simultaneously while the punch pin 2 being left punched through the green sheets. Moreover, during the punching and boring work and the lamination work, the work to push out boring refuse made in the punching and boring work through the hollow portion of the cylinder of the cylindrical punch pin 2 is conducted and thereby the boring refuse can be discharged through the cylinder of the punch pin 2. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003224031(A) 申请公布日期 2003.08.08
申请号 JP20020020116 申请日期 2002.01.29
申请人 TOKO INC 发明人 SHIGA MOTOTSUGU
分类号 H01F41/04;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01F41/04
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