发明名称 Verfahren zur fest haftenden Verbindung eines Epoxydharzkittes auf einer Körperoberfläche
摘要 <p>Process for the bonding of filled epoxide resins to the surface of a body comprises (a) treating the surface of the body prior to chemically bonding to a bonding layer (b) preparing the bonding layer ready for bonding, and (c) contacting the bonding layer with the treated surface. The bonding layer consists of an epoxide resin containing a stabiliser which retains the epoxide resin in pliable form until the plastic body to be bonded is placed in position on the bonding layer. The plastic body is then fixed to the bonding layer while this layer is flexible. The body to which the filled epoxide resin is bonded may be a plastic body, e.g. polyethylene or polypropylene, or may be a metal body.</p>
申请公布号 CH504523(A) 申请公布日期 1971.03.15
申请号 CH19650015204 申请日期 1965.11.03
申请人 INTERNATIONAL STANDARD ELECTRIC CORPORATION 发明人 ROBERT LOVELOCK,LEONARD;RICHARD WAY,KENNETH;HENRY WREN,ROBERT
分类号 C08J7/04;H01B3/30;H01B3/40;(IPC1-7):C09K3/10;H02G15/00 主分类号 C08J7/04
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