EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE

摘要

PURPOSE: An epoxy resin composition used for sealing a semiconductor device is provided, which composition is improved in the high temperature cracking resistance, the curing property and the mechanical properties and provides excellent reliance and molding property in semiconductor package molding. CONSTITUTION: The epoxy resin composition comprises 3.5-15.0 wt% of an amorphous dual biphenyl-based epoxy resin represented by the formula 1; 2.0-10.5 wt% of a curing agent; 0.1-0.3 wt% of a curing accelerator; 0.5-1.5 wt% of modified silicone oil; and 73-90 wt% of an inorganic filler. Optionally the composition comprises further a biphenyl epoxy resin with an epoxy equivalence of 150-250 or an o-cresol novolac epoxy resin with an epoxy equivalence of 170-230 as an epoxy resin. Preferably the curing agent comprises a phenol novolac resin up to the amount of 50 wt% or more.