发明名称 |
Semiconductor package with crack-preventing member |
摘要 |
A semiconductor package with a crack-preventing member is proposed, in which a chip is mounted on a chip carrier by means of an adhesive and is electrically connected to the chip carrier. The crack-preventing member is formed at a proper position on the chip, and generates compression stress on the chip to sufficiently counteract tension stress produced from the chip carrier and adhesive in a molding process. This can effectively prevent the chip from cracking during molding, and thus improve the quality of fabricated products.
|
申请公布号 |
US2003094676(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20010026594 |
申请日期 |
2001.12.20 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
HUANG CHIEN -PING;HO TZONG-DA |
分类号 |
H01L23/00;H01L23/24;H01L23/31;(IPC1-7):H01L23/495;H01L23/28 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|