RESIN COMPOSITION WITH HIGH THERMAL CONDUCTIVITY AND PROCESS FOR PRODUCING THE SAME

摘要

A resin composition having high thermal conductivity and excellent moldability. The composition comprises at least 40 vol.% matrix resin, 10 to 55 vol.% thermally conductive filler dispersed in the matrix resin, and as the remainder a low−melting alloy connecting the thermally conductive filler to each other and having a melting point of 500°C or lower, the ratio of the volume of the low−melting alloy to that of the thermally conductive filler being from 1/30 to 3/1.