| 摘要 |
PROBLEM TO BE SOLVED: To enable soldering without causing lift-off when using lead free solder by alleviating the local temperature difference caused in the member to be soldered. SOLUTION: The device for flow soldering 21 comprises a member to be soldered 25, a conveyer belt 26, a jet means 28 for ejecting a fused solder 27 to the member 25, and a heating means 29 placed with a spacing from the member 25 at the opposite side of the jet means 28 relative to the member 25. The heating means 29 contains a heat source 30 and a heat collecting means 22. The heat generated from the heat source 30 is collected in the local area of the member 25 with the fused solder 27 being supplied by the heat collecting means 22. Consequently, the local temperature difference on the member 25 is alleviated, so that the solidification speed of solder at each location is uniformalized, resulting in solidification substantially at the same time to prevent lift-off. |
