发明名称 PACKAGE FOR OPTICAL COMMUNICATION
摘要 PROBLEM TO BE SOLVED: To provide a package for optical communication which reduces the attenuation of a high-frequency signal passing through a connector core of a coaxial connector. SOLUTION: The package 10 for optical communication which has a metallic frame body 11 forming a cavity part 14 for mounting a semiconductor element for optical communication inside, a side wall part 16 which is joined with a fitting part 15 punched in one side wall of the frame body 11 by using a high- temperature solder material, and a metallic adapter 18 which is united with the side wall part 16 and has a pedestal part 17 arranged at the cavity part 14 of the frame body 11, and also has an insertion hole 20 for connecting a coaxial connector 19 at the side wall part 16 has a groove 22 formed in the pedestal part 17 along the side wall part 16 at the corner part 21 where the side wall part 16 of the adapter 18 and the pedestal part 17 cross each other at right angles.
申请公布号 JP2003057497(A) 申请公布日期 2003.02.26
申请号 JP20010249207 申请日期 2001.08.20
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 ITAKURA HIDEAKI
分类号 G02B6/42;(IPC1-7):G02B6/42 主分类号 G02B6/42
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