发明名称 Method for producing copper foil, copper foils and use
摘要 <p>The invention discloses a method of producing electrodeposited copper foil by electrolysis whereby the electrolysis uses an electrolyte to which have been added a chemical compound having a 3-mercapto 1-propansulphonate and chloride ions. The method of the invention provides copper foil which has a high etching factor and high tensile strength and whereby fine patterning can be achieved without leaving behind copper nodules at the roots of the wiring pattern and which copper foil has large high-temperature elongation and high tensile strength. The method also provides an electrodeposited copper foil with a matte side having a surface roughness which is substantially the same as, or less than that of the shiny side.</p>
申请公布号 SK282866(B6) 申请公布日期 2003.01.09
申请号 SK19980000344 申请日期 1996.09.16
申请人 CIRCUIT FOIL LUXEMBOURG TRADING S.A.R.L. 发明人 OTSUKA HIDEO;STREEL MICHEL;SUZUKI AKITOSHI;WOLSKI ADAM M.
分类号 C25D1/04;C25F3/02;H05K1/09;H05K3/00;(IPC1-7):C25D1/04 主分类号 C25D1/04
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