RELEASE SHEET FOR SEMICONDUCTOR MOLD

摘要

PROBLEM TO BE SOLVED: To provide a release sheet for a semiconductor mold which prevents the mold part of the sheet-mount side from being contaminated when a semiconductor package is molded using the sheet. SOLUTION: This release sheet for a semiconductor mold shows a carbon dioxide gas permeability of not more than 20×10<-14> m<3> /m<2> /sec/Pa.