| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip component which can be much more mass-produced in a shorter time with higher manufacturing efficiency than usual, and to provide its manufacturing method. SOLUTION: A plate is formed of heat-resistant electrical insulating material, and slits 11 are cut in parallel with each other in the plate at intervals as long as the length of the board of a chip for the formation of a board unit BU. An electrode 14 is provided to each end face of a board 12 adjacent to the slit 11. An electrical material 15 such as a resistive material or the like is provided on the surface of a part of the board 12 sandwiched between the electrodes 14. The electrical material 15 is coated with a protective film 16 so as to be protected. The board unit 12 is cut at intervals as wide as the width of a chip for the manufacture of the chips.</p> |
