发明名称 INDUCTOR BUILT-IN PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide an inductor built-in printed wiring board which reduces the number of steps and manufacturing costs, and is superior in reliability, and to provide its manufacturing method. SOLUTION: At predetermined positions on a base plate 10 which comprises a two-layer printed wiring board formed with a predetermined circuit pattern on both surfaces, a plurality of 2 mm long, 50μm wide, and 40μm deep grooves 12 are provided at a 100-μm pitch. A thin film conductive layer is formed on the groove 12 and an insulation layer 12a, and a 5-μm thick resist pattern 21 having an opening part 22 is formed on the thin film conductive layer. An electrolytic copper plating is performed with the resist pattern 21 as a plating mask, a 5-μm thick conductive layer 31 is formed in the opening part 22, and the resist pattern 21 is separated. The thin film conductive layer beneath the resist pattern is removed by soft etching to form a conductive wire 31a, and further an inductor 20a having a magnetic material contained layer is formed on the conductive wire 31a formed at a lower position, to obtain an inductor built-in printed wiring board 100.</p>
申请公布号 JP2002324962(A) 申请公布日期 2002.11.08
申请号 JP20010176686 申请日期 2001.06.12
申请人 TOPPAN PRINTING CO LTD 发明人 NAKAMURA KIYOTOMO;SEKINE HIDEKATSU
分类号 H05K1/16;H01F17/00;H05K3/28;H05K3/46;(IPC1-7):H05K1/16 主分类号 H05K1/16
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