发明名称 POLYMER, RESIST COMPOSITION AND PATTERNING PROCESS
摘要 PURPOSE: Provided are a polymer having improved reactivity, robustness and substrate adhesion as well as minimized swell during development, a resist composition comprising the polymer as a base resin, which has the advantages of high reactivity of acid-decomposable groups and good substrate adhesion and give relatively satisfactory results with respect to sensitivity and resolution, and a patterning process using the resist composition. CONSTITUTION: The polymer comprises recurring units of the formula(1) and has a weight average molecular weight of 1,000 to 500,000. In the formula, R1 and R2 each are hydrogen or methyl, R3 and R4 each are hydrogen or monovalent hydrocarbon, each of R5 to R8 is hydrogen, a hydroxyl group or monovalent hydrocarbon, R9 and R10 each are hydrogen or methyl, each of R11 to R14 is hydrogen or monovalent hydrocarbon, R15 is hydrogen, methyl or CH2CO2R17, R16 is hydrogen, methyl or CO2R17, R17 is an alkyl group, R18 is hydrogen or monovalent hydrocarbon, R19 is monovalent hydrocarbon, R20 is an alkyl group, R21 is an acid labile group, k is 0 or 1, x1, x2, x3, a, b, c and d represent a molar compositional ratio of the recurring units associated therewith, satisfying x1+x2+x3+a+b+c+d=1, x1, x2, x3, a, b and c are numbers inclusive of 0, d is a number of more than 0, all of x1, x2 and x3 are not equal to 0 at the same time.
申请公布号 KR20020070792(A) 申请公布日期 2002.09.11
申请号 KR20020007676 申请日期 2002.02.09
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 FUNATSU KENJI;NAKASHIMA MUSTUO;NISHI TSUNEHIRO;TACHIBANA SEIICHIRO
分类号 G03F7/004;C08F216/16;C08F220/18;C08F220/28;C08F224/00;C08F232/08;G03F7/039;(IPC1-7):G03F7/004 主分类号 G03F7/004
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