| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device in which a surface acoustic wave element is not destroyed by electric discharge during the element manufacture and the position recognition of a bump formed from the rear plane to the principal plane of the element is possible and easy, and which is applicable at high frequency and is small-sized. SOLUTION: In this surface acoustic wave device S1, where an exciting electrode 2 is formed on one principal plane of a piezoelectric substrate 1 having light transmittance and a transparent conducting film 5, is formed on the other principal plane respectively, and the one principal plane side of the substrate 1 is fixed to the base 8 via connection members 4, the transparent conducting film 5 is formed, while the film 5 is set 1/4 to 5 times in thickness compared to arithmetic average roughness (Ra) of in the other principal plane of the substrate 1.
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