发明名称 Fingered capacitor in an integrated circuit
摘要 A fingered capacitor in an integrated circuit. A first capacitor element is formed in a first layer of an integrated circuit (IC) die. The first capacitor element includes a positive plate and a negative plate. Each of the positive and negative plates of the first capacitor element has a plurality of fingers interdigitated with the fingers of the other of the positive and negative plates of the first capacitor element. The fingers are separated by a dielectric. The interdigitated fingers cooperate to generate fringe capacitance between neighboring fingers. A plurality of capacitor elements having interdigitated fingers can be provided in adjacent layers of the IC die.
申请公布号 US6385033(B1) 申请公布日期 2002.05.07
申请号 US20000675540 申请日期 2000.09.29
申请人 INTEL CORPORATION 发明人 JAVANIFARD JAHANSHIR J.;GIDUTURI HARI R.;NAZARETH MATHEW B.
分类号 H01L27/08;(IPC1-7):H01G4/228 主分类号 H01L27/08
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