发明名称 |
Fingered capacitor in an integrated circuit |
摘要 |
A fingered capacitor in an integrated circuit. A first capacitor element is formed in a first layer of an integrated circuit (IC) die. The first capacitor element includes a positive plate and a negative plate. Each of the positive and negative plates of the first capacitor element has a plurality of fingers interdigitated with the fingers of the other of the positive and negative plates of the first capacitor element. The fingers are separated by a dielectric. The interdigitated fingers cooperate to generate fringe capacitance between neighboring fingers. A plurality of capacitor elements having interdigitated fingers can be provided in adjacent layers of the IC die.
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申请公布号 |
US6385033(B1) |
申请公布日期 |
2002.05.07 |
申请号 |
US20000675540 |
申请日期 |
2000.09.29 |
申请人 |
INTEL CORPORATION |
发明人 |
JAVANIFARD JAHANSHIR J.;GIDUTURI HARI R.;NAZARETH MATHEW B. |
分类号 |
H01L27/08;(IPC1-7):H01G4/228 |
主分类号 |
H01L27/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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