| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor optical module that can significantly shorten the manufacturing cycle time. SOLUTION: This semiconductor optical module is provided with a semiconductor laser element 2 which outputs a laser beam, a first carrier 3 to which the element 2 is fixedly attached, and a photodiode 5 which receives a laser beam for monitoring outputted from the rear surface of the element 1. The module is also provided with a second carrier 6 to which the photodiode 5 is fixedly attached and a pedestal 7 to which the first and second carriers 3 and 6 are fixedly attached by soldering. At a prescribed position of the pedestal 7, a solder sheet 21 is fixedly attached in advance for soldering the carriers 3 and 6. The sheet 21 is fixedly attached to the pedestal 7 by thermocompression bonding.
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