发明名称 THERMOELECTRIC COOLING MODULE WITH TEMPERATURE SENSOR
摘要 Disclosed is a thermoelectric cooling module with a temperature sensor integrally attached thereto capable of temperature control of an object to be cooled or heated at the same time as prevention of overheating of the thermoelectric cooling module. The thermoelectric cooling module comprises a pair of insulating substrates, thermoelectric elements, a film-type temperature sensor and an insulating thin film layer. The insulating substrates are apart from each other. When electric power is supplied to the thermoelectric cooling module, one insulating substrate is cooled and the other insulating substrate is heated simultaneously. The thermoelectric elements are interposed between the insulating substrates. The film-type temperature sensor is formed on an outer surface of the insulating substrate. The insulating thin film layer is formed on an outer surface of the temperature sensor.
申请公布号 WO0221609(A1) 申请公布日期 2002.03.14
申请号 WO2000KR01156 申请日期 2000.10.17
申请人 KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY;HA, HEONPHIL;HYUN, DOWBIN;SHIM, JAEDONG 发明人 HA, HEONPHIL;HYUN, DOWBIN;SHIM, JAEDONG
分类号 H01L35/34;F25B21/02;F25B49/00;H01L35/32;(IPC1-7):H01L35/34;G01K7/01 主分类号 H01L35/34
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